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  3. (a) for the soft-contact lithography process, the

(a) For the soft-contact lithography process, the usual application methods of the resist of shallow structures...

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Civil Engineering

(a) For the soft-contact lithography process, the usualapplication methods of the resist of shallow structures is by usinga spinner. Suggest alternative choices for resist application fordeep (e.g. MEMS) features.
(b) Explain the options for a zero gap distance in contactlithography.
(c) Using schematics where necessary, describe;
(i) How diffraction effects modify the resist profile for positiveand negative resist.
(ii) Methods by which an ideal resist profile for a lift-offprocesses may be realised.
(d) A resist is applied by spinner giving a particular thickness.Describe possible strategies to double the resist thickness forthis resist.

Answer & Explanation Solved by verified expert
3.6 Ratings (432 Votes)
a Pattern TransferLithography in the MEMS context is typically the transfer of apattern to a photosensitive material by selective exposure to aradiation source such as light A photosensitive material is amaterial that experiences a change in its physical properties whenexposed to a radiation source If we selectively expose aphotosensitive material to radiation eg by masking some of theradiation the pattern of the radiation on the material istransferred to the material exposed as the properties of theexposed and unexposed regions differs as shown in figure This discussion will focus on optical lithography which issimply lithography using a radiation source with wavelengths inthe visible spectrumIn lithography for micromachining the photosensitive materialused is typically a photoresist also called resist otherphotosensitive polymers are also used When resist is exposed to aradiation source of a specific a wavelength    See Answer
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