QUESTION 1
What is NOT a solid reason to recommend sputtering in Argon
instead of e-beam deposition?
1.
You...
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Electrical Engineering
QUESTION 1
What is NOT a solid reason to recommend sputtering in Argoninstead of e-beam deposition?
1.
You want purer films with no trapped inert gas.
2.
You want better film adhesion.
3.
You want to deposit a multicomponent film like, TiW.
4.
You want better step coverage.
10 points  Â
QUESTION 2
What is NOT a solid reason to recommend e-beam deposition ofaluminum over sputtering in Argon?
1.
We want the higher throughput (# wafers processed per hour)offered by e-beam deposition.
2.
The high temperatures required to get an acceptable depositionrate will scorch the aluminum film and degrade its resistivity.
3.
We want to avoid damaging the wafer by exposing it to aplasma.
4.
We want \"line of sight\" deposition to create special featuresthat rely on portions of the wafer being blocked fromdeposition.
Answer & Explanation
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3.6 Ratings (293 Votes)
Question 1 What is NOT a solid reason to recommend sputtering in Argon instead of ebeam deposition Explanation Sputtering process involves ejecting material from a target that is a source onto a substrate such as a silicon wafer in a vacuum chamber This effect is
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